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"Our superior quality products provide non-hazardous material solutions to subscribe related industry codes of practice for the world's general non-volatile memory needs in computing, communication, consumer and industrial markets, and applications".

 

提供客戶符合國際相關環保法規之高品質產品 』。

 

                     --  KS Chiu  CEO

 
      
      
        
    
Environmental concerns, growing public pressure and regulatory measures are changing the way people do business around the world. Customers are increasingly demanding environmental-friendly products that are delivered by IC companies. It is becoming increasingly important for IC suppliers to demonstrate that not only their philosophies but also their strategies and day-to-day operations operate in an environment-sustainable condition.

 

Even for its business nature as an IC design house, Eon achieves ISO 14001:2004 certification in April 2006, assessed by SGS Taiwan Ltd., an UK accredited registrar. In addition, contracted foundries and assembly houses are required to be an ISO 14001-certified organization as well.

 

 
      
    

 

 
        
    
Eon green products comply with most of the world’s related environmental standards, including those in Europe and Japan. For example, our green products conform to the European Union’s Restriction of Hazardous Substances (RoHS), which controls the use of certain materials. The directive ensures that from 1st July 2006, new electrical and electronic equipment placed on the market does not contain:

 

Cadmium
Lead
Mercury
Hexavalent Chromium
Polybrominated Biphenyls (PBBs)
Polybrominated Diphenyl Ethers (PBDEs)
 

 
      
      

    
Eon has already provided a number of Flash products with lead-free external terminals. The composition and plating thickness of the lead-free solder solutions follow:

 
    
(1) Outer lead: Pure Sn plating,

      Plating thickness: 300 to 800 micro-inches
(2) Solder ball: 96.5 Sn /3 Ag /0.5 Cu

 
 

                        Note: Discrimination of lead-free product:

                                  “P" is added into the end of the part number referred to the packing document and IC

                                  top mark.


      
    

 

 
        
    
Green compound1 has been evaluated by several industry consortia and Eon assemblers. Safe materials for replacement have been successfully developed with wide molding window and excellent releasability, and are commercially available now. The providers include Hitachi Chemical, Sumitomo Bakelite, etc. Eon has applied the green compounds for all lead-free products2.

 

Note: 1. Based on input from Japan Electrical Insulating Materials Industrial

             Association, the contents of green compound should be tested by fluorescence X-ray to satisfy

             1) Br < 0.09% (900 ppm),

             2) Cl < 0.09% (900 ppm),

             3) Sb< 0.09% (900 ppm).

         2. The suitable green compound for lead-free products areavailable by complying  with criteria

             specified in JEDEC level 3 and triple IR reflow @ 260 degree C.  

 
      
      
      
        
    
ESSI has received environmental awards as below.

 

2005 June – Qualified as Samsung Electronics Eco- Partner

 

2007 June – Certified as Sony Corporation’s Green Partner