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  Semiconductor Quality Assurance  

      
        
    
Eon provides simulation models for each Flash manufactured. These models are revised as new device and technologies are developed. Characterization data on each device are performed and retained in Eon database. Additional characterization data are available on a case-by-case basis.
 
      
      
        
    
Since Eon is one of the advanced Flash design houses in the world, we serve hundreds of customers with different needs and applications. In order to satisfy all customers’ needs, we offer the Flash products with leading-edge IC process technologies in 0.18- micron, and 0.23-micron generations.

 

The process technology is developed in accordance with standardized methodologies.

Each new technology must pass a rigorous qualification procedure based on typical industry standards before it is released to mass production.

 
      
      
        
    
Our qualified assembly houses offer IC packaging design and fabricate a full array of packaging for Eon products, with pin counts from 32 to 48.

 

Major packaging offers include mini ball grid array (mini BGA), small outline packages (TSOP), PLCC, and PDIP. To ensure that they create world class packages, themajor assembly houses are ISO 9000 and ISO 14001 certified companies.

 
      
      
        
    
The purpose of testing is to verify the conformance to Eon specifications before

 

The products are delivered to customers. Electrical testing consists of three steps:

(1) Continuity test. (2) test of DC parameters, and (3) functional and dynamic test (AC). It is used for verifying IC performance and conformance to Eon published data sheet.